PCB LIBRARY EXPERT
A PCB Library Automation Tool
Request for quotation now
PCB LIBRARY EXPERT
The PCB Library Expert Enterprise is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts footprint creation costs by as much as 99% per part.
Save your work, search/retrieve it later, modify data (component and preferences), and rebuild part(s)! The idea is that once you key in a part, you never have to enter it again - regardless how many permutations you will need of the same part!
The FPX files can contain customized columns/data that are specific to your requirements! Add columns and build your content for easy retrieval.
Organize your FPX library data files by component family, package lead type, component mfr. or keep all parts in one file.
When you need to copy/move parts from one FPX data file to another, it is a snap!
The PCB Library Expert lets you easily organize your component information so that it is saved in a logical manner that allows you to quickly retrieve it later.
Easily create 3D STEP models from the Library Expert for dozens of component families by just entering the component dimensional data. You even get to select color preferences for various aspects of the components! The 3D STEP output is an additional cost to the Footprint (CAD output) modules.
The Search/Replace feature will easily apply your required changes to any of parts library you specify. We also included a handy Undo/Redo feature so you can maintain your sanity.
You can sort by component category types at the click of your mouse to filter out components you want to omit from your search.
Your component data is only best organized by your unique requirements - this is why we empowered you with flexibility to categorize your components as you need them!
With a few clicks, you can translate any FPX part (or multiple parts) you selected, into the CAD format of your choice!
By having the Default and User Preferences applied, your parts will come out consistent and based on customer requirements - each time!
Once you find the part of interest, easily view your the footprint and quality control it!
You can also modify component dimensions, change feature colors, hide/show layers, link to the component manufacturer's online datasheet (online or on your PC or network). You can also view the footprint and superimposed component, perform solder joint analysis for min/max package tolerances, and more!
PCB LIBRARY EXPERT ENTERPRISE EDITION - FOR ALTIUM DESIGNER
If you consider tolerance settings, units, line-widths, pad shapes, rotations, and many dozens of other settings (all configurable with the PCB Library Expert), you can create over 1,800 variations of ONE SINGLE library! We empower you to quickly build high-quality standard libraries to meet your specific needs.
5-Tier Density Variations Supported
-
IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices. The geometry furnished for these devices, as well as inward and "J" - formed lead contact device families, may provide a wider process window for reflow solder processes as well.
-
IPC B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded Gull Wing type devices.
-
IPC C: Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories. The use of classes of performance 1, 2, and 3 is combined with that of component density levels A, B, and C in explaining the condition of an electronic assembly. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly.
-
User-defined preferences. Companies can establish a standard set of preferences to apply to all users of the PCB Library Expert! Settings include:
- Units (Mils, Micrometers, Inches and Millimeters)
- Pad Shape (Rectangle, Oblong, D-Shape or Rounded Rectangle)
- Rotation (Pin 1 Up, Left, Right or Down)
- Origin (Centric or Pin 1)
- Environment Level (Least, Nominal or Most)
- Silkscreen Line Width and Pad to Silkscreen Gap
- Minimum Pad to Pad Gap or Pad to Thermal Pad Gap
- Paste Mask Reduction for Thermal Pads
- Solder Mask Swell or Solder Mask Defined Pads
- Map Silkscreen and Assembly to Nominal body or Maximum Body
- ...and more! -
Component manufacturer-recommended footprint.
The Library Expert is synchronized to the latest guidelines of the IPC-7351, and IPC-J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies). You want your PCB Layout to pass the J-STD-001 standard for solder joint acceptability in the PCB assembly process. You also get the ability to migrate your entire library to future revisions or your own custom-defined requirements as well! Why is this important? Because it ensures that everybody - regardless of experience or language - can build high-quality parts in the same standard, professional way!
Improve your PCB Library skills with solder joint goal knowledge. Take the IPC-J-STD-001 training class ASAP! The PCB designer and EE engineer should have as much information about the PCB assembly process as possible for DFA (Design for Assembly).
PCB Library experts supports following ECAD Tools:
