Bundled Software

What do we offer?

Ucamco supplies front-end and RIP software to manufacturers of the following types of equipment:

  • DI (direct imaging)

  • AOI

  • AVI

  • Ink jet

  • ET (electrical test)

The bundled software is customized  according to the manufacturer’s specification, who can bundle with the equipment, under his own brand.

In today's competitive landscape a manufacturer needs the very best front-end software. Re-using Ucamco's existing software and continuous development results a more performant product at a lower R&D cost. As can be seen from the references Ucamco’s solutions are in use from standard PCB applications to the most demanding IC packaging.

See also Format Converters & RIPs

Contact us to find out more about Bundled Software.